Solder paste in electronics packaging

Name: Solder paste in electronics packaging
Author: / Jennie S.Hwang

Author

Edition 1

0-442-20754-9

list

شناسنامه

Main Entry

Hwang, Jennie S.، نویسنده

Title and Author

Solder paste in electronics packaging / / Jennie S.Hwang

Publication Details

نیویورک : : Van Nostrand Reinhold، 1989م

Physical Description

xxii, 456p.؛ ; 25 cm؛ : ill..

Subject

Printed circuits
Design and construction
Solder pastes
surfacemount technology

Language

انگلیسی

Retrieval Number

Congress:

Notes

انگليسي.

Includes index.