Reflow Soldering Processes and Troubleshooting , SMT,BGA, CSP and Flip chip Technologies
Ning-Cheng Lee
Reflow Soldering Processes and Troubleshooting , SMT,BGA, CSP and Flip chip Technologies
Author
Ning-Cheng LeePublisher
NewnesEdition 1
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شناسنامه
Main Entry
Ning-Cheng Lee، نویسندهTitle and Author
Reflow Soldering Processes and Troubleshooting , SMT,BGA, CSP and Flip chip TechnologiesPublication Details
: Newnes، 2002مSubject
ElectronicsMechatronics
Language
انگلیسیCataloger
کانورتور